NimbleAI

๐ Project Webpage: https://www.nimbleai.eu | ๐ช๐บ CORDIS Factsheet: https://cordis.europa.eu/project/id/101070679
NimbleAI (Ultra-energy efficient and secure neuromorphic sensing and processing at the endpoint) is a Horizon Europe research project (Grant Agreement ID 101070679) funded under the HORIZON-CL4-2021-DIGITAL-EMERGING-01 programme.
๐ Project Timeline & Factsheet
- Start Date: October 1, 2022
- End Date: March 31, 2026
- Duration: 42 Months
- Funding Scheme: Horizon Europe (Research and Innovation Action - HORIZON-RIA)
- Grant Agreement ID: 101070679
- Overall Budget: โฌ6,000,000+ (EU Contribution)
๐ฏ Objectives & Scope
Traditional visual computing pipelines (cameras connected to separate CPU/GPUs) are highly inefficient, wasting substantial energy transmitting redundant video frames. NimbleAI developed an energy-efficient sensing-processing system operating on event-driven, bio-inspired principles.
๐ก Key Research Innovations
- Event-Based Sensing: Integrated dynamic event vision sensors that process visual changes at pixel level, eliminating redundant frame capture.
- 3D Neuromorphic Integration: Stacked sensing layers directly above event-driven in-memory neural processing arrays.
- Adaptive Edge AI: Enabled dynamic trade-offs between energy consumption, latency, and inference accuracy for autonomous robotics and IoT nodes.
๐๏ธ BSC Key Role & Research Deliverables
As a core partner in NimbleAI, Barcelona Supercomputing Center (BSC) led critical research thrusts in neuromorphic hardware architecture and edge AI dependability:
- Neuromorphic Execution Trade-Offs: Co-designed the architectural framework balancing bio-inspired event-driven vision processing with 3D stacked in-memory neural acceleration.
- Predictability & Dependability: Developed safety and execution models to guarantee bounded response times for edge AI inferences.
- Flagship Publication: Led and co-authored the flagship project paper at Design, Automation and Test in Europe (DATE 2023): “NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips”.
๐ Associated Publications
- NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips
X. Iturbe, N. Abderrahmane, J. Abella, S. Alcaide, et al. โ DATE 2023 (DOI: 10.23919/DATE56975.2023.10136952)
๐๏ธ Consortium Partners
(Partners are listed in no particular order)
The NimbleAI consortium brings together 19 leading European research centers, universities, semiconductor companies, and industrial leaders extracted directly from the official project website (nimbleai.eu/consortium):
- ๐ช๐ธ IKERLAN S. Coop (Spain, Coordinator)
- ๐ช๐ธ Barcelona Supercomputing Center (BSC) (Spain)
- ๐ช๐ธ IMSE-CNM (CSIC / Universidad de Sevilla) (Spain)
- ๐ช๐ธ Universitat Politรจcnica de Valรจncia (UPV) (Spain)
- ๐ช๐ธ ULMA Medical Technologies (Spain)
- ๐ฌ๐ง The University of Manchester (United Kingdom)
- ๐ฌ๐ง Queen Mary University of London (United Kingdom)
- ๐ซ๐ท CEA-Leti (France)
- ๐ซ๐ท Menta (France)
- ๐ง๐ช IMEC (Belgium)
- ๐ฆ๐น TU Wien (Vienna University of Technology) (Austria)
- ๐ฆ๐น AVL List GmbH (Austria)
- ๐ฆ๐น Viewpointsystem (Austria)
- ๐ณ๐ฑ Leiden University (Netherlands)
- ๐ณ๐ฑ Eindhoven University of Technology (TU/e) (Netherlands)
- ๐ฉ๐ช Codasip (Germany / Czech Republic)
- ๐ฉ๐ช Raytrix (Germany)
- ๐ฎ๐น Politecnico di Milano (Polimi) (Italy)
- ๐ฎ๐น Monozukuri Technologies (Italy)
- ๐บ๐ธ Snap Inc. (United States / Austria)
๐ผ Industry Advisory Board & Partners
- ๐ช๐บ European Space Agency (ESA)
- ๐ณ๐ฑ ASML
- ๐บ๐ธ Cadence Design Systems
- ๐บ๐ธ Collins Aerospace
- ๐ซ๐ท Prophesee
- ๐บ๐ธ Edge Impulse
